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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1CHJGTNN-002A spec no.: ds20-2008-0251effective date: 12/09/2008revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * lead (pb) free product C rohs compliant * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirement. * 3.1 mm diameter package. package dimensions part no. lens source color ltl1chjgtnn - 002a green transparent alingap green notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm ( .010") unless otherwise noted. 3. protruded resin under flange is 1.0mm ( .04") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice. 6. the led lamp use ltl1chjgtnn part no. : ltl1chjgtnn - 002a page : 1 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25oc parameter maximum rating unit power dissipation 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma dc forward current 30 ma derating linear from 50 c 0.4 ma/ c reverse voltage 5 v operating temperature range - 40 c to + 100 c storage temperature range - 55 c to + 100 c lead soldering temperature [2.0mm(.078 ") from body] 260 c for 5 seconds m ax. part no. : ltl1chjgtnn - 002a page : 2 of 11 bns - od - c131/a 4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at t a =25 oc parameter symbol min. typ. max. unit test condition luminous intensity i v 110 240 520 mcd i f = 20ma note 1 viewing angle 2 1/2 45 deg note 2 (fig.5) peak emission wavelength p 575 nm measurement @peak (fig.1) dominant wavelength d 566 572 578 nm note 4 spectral line half - width ? 11 nm forward voltage v f 1.5 2.1 2.4 v i f = 20ma reverse curre nt i r 100 a v r = 5v capacitance c 40 pf v f = 0 , f = 1mhz note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wave length which defines the color of the device. part no. : ltl1chjgtnn - 002a page : 3 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25oc ambient temperature unless otherwise noted) part no. : ltl1chjgtnn - 002a page : 4 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic insertion equipment. * most radial lead plastic lead lamps available packaged in tape and reel. * 2.54mm (0.1") straight lea d spacing available. * reel packaging simplifies handling and testing. folding packaging is available by adding suffix a on option. package dimensions specification item symbol minimum maximum mm inch mm inch t ape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 feed hole to bottom of component h1 17.5 0.688 18.5 0.728 feed hole to overall component height h2 22.4 0.882 24.0 0.945 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead loca tion p1 4.4 0.173 5.80 0.228 center of component location p2 5.05 0.198 7.65 0.301 total taped thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape width w1 14.5 0.571 15.5 0.610 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : ltl1chjgtnn - 002a page : 5 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y packing spec 3000 pcs per inner carton 10 inner cartons per outer carton total 30000 pcs per outer carton part no. : ltl1chjgtnn - 002a page : 6 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y bin table specification. luminous intensity unit : mcd @20ma bin code min. max. fg 1 1 0 180 hj 180 310 kl 310 520 note : tolerance of each bin limit is 15% dominant wavelength unit : nm @20ma bin code min. max. h06 566.0 568.0 h07 568.0 570.0 h08 570.0 572.0 h09 572.0 574.0 h10 574.0 576.0 h11 576.0 578.0 note: tolerance of each bin lim it is 1nm part no. : ltl1chjgtnn - 002a page : 7 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipme nt and household applications).consult liteons sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviat ion, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum dur ing forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 5. soldering when soldering, for lamp without stopper type and must be leave a minimum of 3 mm clearance from the base of the lens to the soldering point . to avoided the epoxy climb up on lead frame and was impact to non - soldering problem, dipping the lens into the solder must be avoided. do not apply any external stress to the l ead frame during soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 300c max. 3 sec. max. (one time only) pre - heat pre - heat time solder wave solde ring time 100c max. 60 sec. max. 260c max. 5 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led part no. : ltl1chjgtnn - 002a page : 8 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the dr ive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on sur face of the leds plastic lens as a result of friction between leds during storage and handing esd - damaged leeds will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or no light up at low currents. to verify for esd damage, check for light up and vf of the suspect leds at low currents. the vf of good leds should be >2.0v@0.1ma for ingan product and >1.4v@0.1ma for alingap product. part no. : ltl1chjgtnn - 002a page : 9 of 11 bns - od - c 131/a4 chip esd level machi ne mode l human body mode l in gan / sapphire 100 v 300 v alingap 200 v 500 v i ngan / sic 600 v 1000 v led led
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. gar ments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dsl? 5. all wrist strap or heel strap checkers calibration up to date? not e: *50v for blue led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge g enerators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective ac tion from previous audits completed? 3. are audit records complete and on file? part no. : ltl1chjgtnn - 002a page : 10 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 8 . reliability test classification test item test condition reference standar d endurance test operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 750d:1026 (1995) mil - std - 883d:1005 (1991) jis c 7021:b - 1 (1982) high temperature high humidity storage ta = 655oc rh= 90 95% test time= 240hrs2hrs mil - std - 202f: 103b(1980) jis c 7021 : b - 11(1982) high temperature storage ta= 1055 oc * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 883d:1008 (1991) jis c 7021:b - 10 (1982) low temperature storage ta= - 555 oc * te st time=1000hrs ( - 24hrs,+72hrs) jis c 7021:b - 12 (1982) environmental test temperature cycling 105 oc 25 oc - 55 oc 25 o c 30mins 5mins 30mins 5mins 10 cycles mil - std - 202f:107d (1980) mil - std - 750d:1051(1995) mil - std - 883d:1010 (1991) jis c 7 021: a - 4(1982) thermal shock 105 5 oc - 55 oc 5 oc 10mins 10mins 10 cycles mil - std - 202f:107d(1980) mil - std - 750d:1051(1995) mil - std - 883d:1011 (1991) solder resistance t.sol = 260 5 oc dwell time= 10 1secs mil - std - 202f:210a(1980) mil - std - 750d:2031(1995) jis c 7021: a - 1(1982) solderability t. sol = 230 5 oc dwell time= 5 1secs mil - std - 202f:208d(1980) mil - std - 750d:2026(1995) mil - std - 883d:2003(1991) jis c 7021: a - 2(1982) 9. others the appearance and specificatio ns of the product may be modified for improvement, without prior notice. part no. : ltl1chjgtnn - 002a page : 11 of 11 bns - od - c131/a4

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